Magic Leap CEO Peggy Johnson took the stage at the Future Investment Initiative (FII) in Riyadh, Saudi Arabia this past week to talk a bit about her time as the company’s new leader. There’s been precious little information surrounding Magic Leap’s second-gen AR headset, however the company also announced that the enterprise-focused device slated to first release in late 2021 with a few notable improvements.
Johnson didn’t speak directly about the company’s next headset on stage at FII, however a slide was shown promising a Q4 2021 window for early access release.
There’s little else to go on for now, however the company says its second-gen headset will be “50% smaller, 20% lighter, with 100% larger field of view.”

Looking at the first-gen Magic Leap headset itself, and not taking into account the compute unit, the 2018 version weighs 316 g, which would make the second-gen device approximately 250 g.
As for FOV, Magic Leap 1 features a 4:3 aspect ratio, and an estimated horizontal FOV of 40 degrees, a vertical FOV of 30 degrees, and a FOV diagonal of 50 degrees. There’s no telling what aspect ratio the next Magic Leap headset will feature, or how the company will effectively market its “100% larger” FOV moving forward; the company only quotes the diagonal FOV of 50 degrees in marketing material.
Here, it’s very likely the company is talking about a 100 percent increase of overall surface area, and not a 100 percent increase of a single spec (re: not going from 40 to 80 horizontal FOV). That would give it around a 55 degree horizontal FOV.
Note: To increase the specs of all provided FOVs by 100 percent, the surface area would need to increase by four times, which is a tall order.
This comes as a modest upgrade, but one that businesses can probably get behind if it’s delivered at a competitive price point comparative to Microsoft’s HoloLens 2, its largest competitor in the field of enterprise-focused AR headsets. Since Magic Leap’s pivot to enterprise last year, the company has been serving mostly the same clientele, which includes industrial applications, medicine, education, and manufacturing.